Thrust 3: System-in-a-package (SiP) prototyping and integration

Thrust leads

Luca Carloni Columbia University	Andrew Kahng University of California, San Diego

Thrust 3 will prototype and integrate SiPs. Thrust 3 focuses on tasks related to the DeCoDe team’s in-house hardware prototyping and tapeout capabilities, as well as interfacing to the extensive external resources provided by federal initiatives. This includes plans to establish strong collaborations with organizations like the National Semiconductor Technology Center and the National Advanced Packaging Manufacturing Program to utilize their cutting-edge hardware prototyping infrastructure, which will significantly reduce costs associated with chiplet-based packaging research and development efforts. Additionally, we aim to strengthen our in-house capabilities for designing test vehicles that validate the energy efficiency of heterogeneous SiPs.

Tasks within this thrust are:

Task 3.1: Internal prototyping

Task leads

Luca Carloni Columbia University	Gu-Yeon Wei Harvard University

Task 3.2: External prototyping and packaging

Task leads

Yu (Kevin) Cao University of Minnesota	Andrew Kahng University of California, San Diego