Among the various SOFC stack designs under development worldwide, the planar configuration has received growing attention because of its compact nature and associated high volumetric power density – design features which are essential in transportation applications. With the advent of anode-supported cells that employ thin YSZ electrolytes, these devices can be operated at reduced temperature (700 - 800°C) and still achieve the same current densities exhibited by their high-temperature, thick electrolyte-supported counterparts. The lower operating temperature not only makes it possible to consider inexpensive, commercially available high temperature alloys for use in the stack and balance of plant, but also expands the list of materials/techniques that could be employed in device sealing. Here we discuss two such methods that may have potential application in pSOFCs.
Revised: April 9, 2010 |
Published: July 20, 2005
Citation
Weil K.S., C.A. Coyle, J.S. Hardy, G. Xia, and J.Y. Kim. 2005.NEW PLANAR SOFC SEALING TECHNIQUES FOR POTENTIAL TRANSPORTATION APPLICATIONS. In Proceedings of SOFC IX, edited by SC Singhal and J Mizusaki, 2, 1957-1966. Pennington, New Jersey:Electrochemical Society.PNNL-SA-45924.