November 18, 2024
Report

Titanium Electroplating from Deep Eutectic Solvent Ethaline: Progress Report

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Abstract

This fiscal year we investigated the kinetic mechanism of electroplating of titanium on stainless steel substrates, as well as the influence of additives on the brightness and smoothness of this plating, as related to the FY24 LD-TCF proposal. Specific issues addressed were: • Influence of additives on the Ti deposits • Influence of counterions on Ti deposits • Presence of common intermediates • Influence of polyol reduction on kinetics and mechanism of Ti layer formation

Published: November 18, 2024

Citation

Grubel K., D.B. Horangic, S.J. Livers, C.J. Chancellor, R.I. Burnett, B.V. Byrd, and S.M. Miley, et al. 2024. Titanium Electroplating from Deep Eutectic Solvent Ethaline: Progress Report Richland, WA: Pacific Northwest National Laboratory.

Research topics

Precision Materials by Design
Materials Sciences