A New Hybird Deposition Process, Combining PML and PECVD, for High Rate Plasma Polymerization of Low Vapor Pressure and Solid, Monomer Precursors

February 1, 1999

Conference Paper

A New Hybird Deposition Process, Combining PML and PECVD, for High Rate Plasma Polymerization of Low Vapor Pressure and Solid, Monomer Precursors

Abstract

There is no abstract currently available for this item

Revised: November 10, 2005 | Published: February 1, 1999

Citation

Affinito J.D., G.L. Graff, M. Shi, M.E. Gross, P.A. Mounier, and M.G. Hall. 1999. A New Hybird Deposition Process, Combining PML and PECVD, for High Rate Plasma Polymerization of Low Vapor Pressure and Solid, Monomer Precursors. In PROCEEDINGS OF THE 42nd ANNUAL TECHNICAL CONFERENCE- SOCIETY OF VACUUM COATERS, 102-107. Albuquerque, New Mexico:Society of Vacuum Coaters. PNWD-SA-4621.