Last month I addressed the subject of pinholes in thin films and ways to minimize them. The subject this month is another cause for success, or failure, of thin films, adhesion. I was motivated to discuss this horrendously complicated subject by a conference I recently attended, Adhesion Aspects of Thin Films (Orlando, December 15-17). This conference, organized by Dr.'s K.L. Mittal and R.H. Lacombe, was both stimulating and informative.
Revised: April 27, 2004 |
Published: February 1, 2004
Citation
Martin P.M. 2004.Thin Film Technology: Adhesion in Thin Films.Vacuum Technology & Coating 5, no. 2:6-12. PNWD-SA-6476.