Use of Electrodeposition for Sample Preparation and Rejection Rate Prediction for Assay of Electroformed Ultra High Purity Copper for 232Th and 238U Prior to Inductively Coupled Plasma Mass Spectrometry (ICP/MS)

July 1, 2008

Journal Article

Use of Electrodeposition for Sample Preparation and Rejection Rate Prediction for Assay of Electroformed Ultra High Purity Copper for 232Th and 238U Prior to Inductively Coupled Plasma Mass Spectrometry (ICP/MS)

Abstract

The search for neutrinoless double beta decay in 76Ge has driven the need for ultra-low background Ge detectors shielded by electroformed copper of ultra-high radiopurity (

Revised: March 9, 2009 | Published: July 1, 2008

Citation

Hoppe E.W., C.E. Aalseth, R.L. Brodzinski, A.R. Day, O.T. Farmer, T.W. Hossbach, and J.I. McIntyre, et al. 2008. Use of Electrodeposition for Sample Preparation and Rejection Rate Prediction for Assay of Electroformed Ultra High Purity Copper for 232Th and 238U Prior to Inductively Coupled Plasma Mass Spectrometry (ICP/MS). Journal of Radioanalytical and Nuclear Chemistry 277, no. 1:103-110. PNNL-SA-61499. doi:10.1007/s10967-008-0716-5