We demonstrate the efficacy of Photoemission Electron Microscopy (PEEM) as a tool to detect metal diffusion processes at nanoscale spatial resolution in real time. For a sample comprising a nominally 1nm physical vapor-deposited (PVD) Ru thin film covering a thick Cu substrate, we have observed the appearance of bright features on a dark background as the temperature is monotonically increased and irradiated with photons from a Hg are lamp. These bright features are the result of a lower work function due to Cu diffusion through the Ru films.
Revised: April 7, 2011 |
Published: October 1, 2007
Citation
Wei W., G. Xiong, Y. Sun, A.G. Joly, K.M. Beck, J.M. White, and W.P. Hess. 2007.Real Time Study of Cu Diffusion Through a Ru Thin Film by Photoemission Electron Microscopy (PEEM). In Materials, technology and reliability of low-k dielectrics and copper interconnects. Materials Research Society Symposium Proceedings; 2006, edited by Ting Y Tsui, 914, 185-190 (Paper no. 0914-F05-07). Warrendale, Pennsylvania:Material Research Society.PNNL-SA-49613.