October 9, 2018
Journal Article

Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Abstract

The microstructure of printed Cu wirings fabricated from air-stable Cu complex inks is greatly modified by low-temperature curing followed by intense pulsed light densification enhancement treatment. The resulting almost full densification of printed Cu wirings enables them to possess a high electrical conductivity of 50% bulk Cu. The dense structure also largely prevents the permeation of oxygen and water into the inner side of the Cu wirings, thereby improving their oxidation resistance and maintaining a stable resistance (R/R0

Revised: February 26, 2020 | Published: October 9, 2018

Citation

Li W., Y. Yang, B. Zhang, C. Li, J. Jiu, and K. Suganuma. 2018. Highly Densified Cu Wirings Fabricated from Air-Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility. Advanced Materials Interfaces 5, no. 19:Article No. 1800798. PNNL-SA-140723. doi:10.1002/admi.201800798