April 21, 2010
Journal Article

Enhancement of Pool-Boiling Heat Transfer using Nanostructured Surfaces on Aluminum and Copper

Abstract

Enhanced pool boiling critical heat fluxes (CHF) at reduced wall superheat on nanostructured substrates are reported. Nanostructured surfaces were realized using a low temperature process, microreactor-assisted-nanomaterial-deposition. Using this technique we deposited ZnO nanostructures on Al and Cu substrates. We observed pool boiling CHF of 82.5 W/cm2 with water as fluid for ZnO on Al versus a CHF of 23.2 W/cm2 on bare Al surface with a wall superheat reduction of 25-38 ?C. These CHF values on ZnO surfaces correspond to a heat transfer coefficient of ~ 23000 W/m2K. We discuss our data and compare the behavior with conventional boiling theory.

Revised: August 2, 2011 | Published: April 21, 2010

Citation

Hendricks T.J., S. Krishnan, C. Choi, C. Chang, and B. Paul. 2010. Enhancement of Pool-Boiling Heat Transfer using Nanostructured Surfaces on Aluminum and Copper. International Journal of Heat and Mass Transfer 53, no. 15-16:3357-3365. PNWD-SA-8866. doi:10.1016/j.ijheatmasstransfer.2010.02.025