Effects of Trace Metals and Organic Additives on Porosity and Dielectric Constant of High Purity Mesoporous Silica Films

July 10, 2003

Journal Article

Effects of Trace Metals and Organic Additives on Porosity and Dielectric Constant of High Purity Mesoporous Silica Films

Abstract

Porous ceramic and porous hybrid ceramic films are potentially useful as low dielectric constant interlayers in semiconductor interconnects (1-6). The ??hybrid?? ceramic films are generally defined as films that contain both organic and ceramic molecular components in the structure, as for example, organosilicate films. A key challenge with advanced dielectric films in interconnects is the need for extremely low dielectric constants (??.0) in very high purity materials (

Revised: August 6, 2004 | Published: July 10, 2003

Citation

Birnbaum J.C., G.E. Fryxell, X.S. Li, C.A. Coyle, G.C. Dunham, and S. Baskaran. 2003. Effects of Trace Metals and Organic Additives on Porosity and Dielectric Constant of High Purity Mesoporous Silica Films. Chemical Communications 2003, no. 15:1830-1831. PNWD-SA-5825.