In bonding an electroactive ceramic to structural metal for electrochemical device application, joining must typically be carried out in an oxidizing environment, nominally at a temperature greater than the device operating temperature (~800°C). Thus, the bond that eventually forms will take place between the functional ceramic component and an oxide scale that grows on the structural metallic component under these conditions. The objective in reactive air brazing (RAB) is to reactively modify one or both oxide faying surfaces with a compound that has been at least partially dissolved in a noble metal solvent, e.g. silver, gold, or platinum, such that the newly formed surface is readily wetted by the remaining molten filler material.